AABCOOLING Thermopad 20x130x3 6 W/mK

Thermal pad without adhesive – 6 W/mK, 3 mm thick

AABCOOLING Thermopad 20x130x3 6 W/mK is a thermally conductive pad with a thermal conductivity of 6 W/mK that transfers heat from the hot component to the heat sink. It has no adhesive layer, so it must be held in place by the mounting pressure of the heat sink.

The pad comes as a single 20 × 130 mm strip that you can cut to the size you need with scissors. Thanks to its high compressibility it fills gaps from 2.5 to 2.8 mm between the chip and the heat sink.

Key features

• Thermal conductivity: 6 W/mK
• No adhesive – easy to remove, the joined surfaces separate without effort
• Compressible material – precisely fills the gap between chip and heat sink
• Flexible structure fills rough surfaces well
• Single 20 × 130 mm strip, cut to size
• Operating temperature range from -50°C to +200°C

Applications

• Laptops – graphics chips and power delivery section
• Desktop PCs – between the heat sink and the GPU of a graphics card, power delivery section (VRM), RAM modules
• Consumer electronics and appliances – LCD TVs, amplifiers and other heat-generating electronics

How to apply the thermal pad

1. Make sure both surfaces are completely clean.
2. Peel off the protective film on one side and place the pad on the chip.
3. Peel off the second film and press the heat sink or cooler onto it.

Specifications

• Dimensions: 20 × 130 × 3 mm
• Thickness: 3 mm
• Thermal conductivity: 6 W/mK
• Operating temperature: from -50°C to +200°C
• Colour: black
• Adhesive: none – held by heat sink pressure

Package contents

• 1 × AABCOOLING Thermopad 20x130x3 6 W/mK