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AABCOOLING Thermopad 20x130x3 1,5 W/mK
- AABCOOLING thermal pad 130 × 20 × 3 mm, 1.5 W/mK, non-adhesive. Compressible – fills gaps from 2.8 to 2.5 mm between a chip and its heatsink. For GPUs, power sections and RAM in PCs and laptops. -50°C to +200°C.
Non-adhesive thermal pad 3 mm – 1.5 W/mK
AABCOOLING Thermopad 20x130x3 1,5 W/mK is a white thermal pad measuring 130 × 20 × 3 mm with a thermal conductivity of 1.5 W/mK. Place it between a heatsink and a heat-generating component to transfer heat efficiently.
The pad comes as one large strip that you can cut to the size you need. Thanks to its high compressibility, it fills gaps from 2.8 mm down to 2.5 mm.

Key features
- Thermal conductivity: 1.5 W/mK
- Thickness: 3 mm – compressible, fills the gap precisely
- Flexible structure that fills rough surfaces perfectly
- No adhesive – easy to fit and remove
- Operating temperature: -50°C to +200°C
- Protective film on both sides

Applications
The pad is ideal wherever a gap between a component and its heatsink needs to be filled:
- laptops and notebooks – graphics chips, power delivery section,
- desktop PCs – graphics cards (between the heatsink and the GPU), power delivery section, RAM modules,
- consumer electronics – LCD TVs, amplifiers and other heat-generating devices.
How to install the thermal pad
- Make sure both surfaces are completely clean.
- If necessary, cut the pad to the size of the component.
- Remove the protective film from one side and place the pad on the chip.
- Remove the film from the other side and press the heatsink or cooler onto it.
Note: the pad has no adhesive layer, so it must be held in place by the mounting pressure of the heatsink.
Specifications
- Dimensions: 130 × 20 × 3 mm
- Thickness: 3 mm
- Thermal conductivity: 1.5 W/mK
- Operating temperature: -50°C to +200°C
- Colour: white
- Adhesive: none
Package contents
- 1 × AABCOOLING Thermopad 20x130x3 1,5 W/mK
- 1 × packaging






